Benefiting from Thermal and Mechanical Simulation in Micro-Electronics WHO International Programme on Chemical Safety den Genfer Völkerbund

den Genfer Völkerbund

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EINLEITUNG -- 2

Benefiting from Thermal and Mechanical Simulation in Micro-Electronics WHO International Programme on Chemical Safety den Genfer VölkerbundBenefiting from Thermal and Mechanical Simulation in Micro Electronics presents papers from the first international conference on this topic, EuroSimE2000. For the first time, people from the electronics industry, research institutes, software companies and universities joined together to discuss present and possible future thermal and mechanical related problems and challenges in micro electronics; the state of the art methodologies for thermal &